Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5355018 | Stress-free semiconductor leadframe | — | 1994-10-11 |
| 5326243 | Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device | — | 1994-07-05 |
| 5306401 | Method for drilling cooling holes in turbine blades | Martien H. H. van Dijk, Ger J. N. E. de Vlieger | 1994-04-26 |
| 5291814 | Lead frame cutting apparatus for integrated circuit packages | — | 1994-03-08 |
| 5275546 | Plastic encapsulation apparatus for an integrated circuit lead frame and method therefor | — | 1994-01-04 |