Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5331116 | Structure and method for forming contact structures in integrated circuits | Michael E. Haslam | 1994-07-19 |
| 5331117 | Method to improve interlevel dielectric planarization | Frank R. Bryant | 1994-07-19 |
| 5321211 | Integrated circuit via structure | Michael E. Haslam | 1994-06-14 |