Issued Patents 1994
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5358598 | Folded bus bar leadframe and method of making | — | 1994-10-25 |
| 5358905 | Semiconductor device having die pad locking to substantially reduce package cracking | — | 1994-10-25 |
| 5359493 | Three dimensional multi-chip module with integral heat sink | — | 1994-10-25 |
| 5307010 | Wafer burn-in and test system | — | 1994-04-26 |
| 5286999 | Folded bus bar leadframe | — | 1994-02-15 |