Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5369545 | De-coupling capacitor on the top of the silicon die by eutectic flip bonding | Debendra Mallik, You Y. Yu | 1994-11-29 |
| 5345363 | Method and apparatus of coupling a die to a lead frame with a tape automated bonded tape that has openings which expose portions of the tape leads | Koushik Banerjee | 1994-09-06 |
| 5307012 | Test substation for testing semi-conductor packages | Jim Cattedra | 1994-04-26 |