Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5319241 | Lead frame without power buses for lead on chip package, and a semiconductor device with conductive tape power distribution | — | 1994-06-07 |
| 5313102 | Integrated circuit device having a polyimide moisture barrier coating | Tadashi Saitoh, Boon Q. Seow | 1994-05-17 |