Issued Patents 1994
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5374344 | Method and apparatus for electrodeposition of a metallurgically bondable circuitized flexible substrate | James Wilcox | 1994-12-20 |
| 5363553 | Method of drilling vias and through holes | Robert D. Edwards, Frank D. Egitto, Paul S. Gursky, David E. Houser, James Steven Kamperman +1 more | 1994-11-15 |
| 5359767 | Method of making multilayered circuit board | William T. Chen, James R. Wilcox, Tien Y. Wu | 1994-11-01 |
| 5347710 | Parallel processor and method of fabrication | Howard L. Heck, John S. Kresge | 1994-09-20 |