RH

Rodney T. Hodgson

IBM: 2 patents #272 of 3,003Top 10%
PF Purdue Research Foundation: 1 patents #8 of 33Top 25%
📍 Ossining, NY: #8 of 57 inventorsTop 15%
🗺 New York: #747 of 7,004 inventorsTop 15%
Overall (1994): #21,414 of 165,921Top 15%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5371399 Compound semiconductor having metallic inclusions and devices fabricated therefrom Jeremy Burroughes, David T. McInturff, Michael R. Melloch, Nobuo Otsuka, Paul M. Solomon +2 more 1994-12-06
5288842 Morphological composite materials formed from different precursors Claudius Feger, David Lewis, Ravi F. Saraf 1994-02-22