RW

Richard D. Weale

IBM: 1 patents #741 of 3,003Top 25%
📍 Owego, NY: #5 of 15 inventorsTop 35%
🗺 New York: #1,860 of 7,004 inventorsTop 30%
Overall (1994): #77,444 of 165,921Top 50%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5288541 Method for metallizing through holes in thin film substrates, and resulting devices Kim J. Blackwell, Pei C. Chen, Stephen E. Deliman, Allan R. Knoll, George J. Matarese 1994-02-22