RD

Renuka S. Divakaruni

IBM: 2 patents #272 of 3,003Top 10%
📍 Ridgefield, CT: #5 of 42 inventorsTop 15%
🗺 Connecticut: #213 of 2,265 inventorsTop 10%
Overall (1994): #22,338 of 165,921Top 15%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5336444 Ceramic via composition, multilayer ceramic circuit containing same, and process for using same Jon A. Casey, Govindarajan Natarajan, Srinivasa S. N. Reddy, Manfred Sammet 1994-08-09
5277725 Process for fabricating a low dielectric composite substrate John Acocella, Peter A. Agostino, Arnold I. Baise, Richard A. Bates, Ray M. Bryant +21 more 1994-01-11