RH

Raymond R. Horton

IBM: 1 patents #741 of 3,003Top 25%
📍 Dover Plains, NY: #1 of 3 inventorsTop 35%
🗺 New York: #1,860 of 7,004 inventorsTop 30%
Overall (1994): #80,499 of 165,921Top 50%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5322204 Electronic substrate multiple location conductor attachment technology Mark F. Bregman, Alphonso P. Lanzetta, Ismail C. Noyan, Michael J. Palmer, Ho-Ming Tong 1994-06-21