Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5371654 | Three dimensional high performance interconnection package | Brian S. Beaman, Fuad E. Doany, Keith E. Fogel, James L. Hedrick, Paul A. Lauro +4 more | 1994-12-06 |
DS
Da-Yuan Shih
Overall (1994): #143,939 of 165,921Top 90%
1
Patents 1994