Issued Patents 1994
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5362360 | Method and product for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces | Thomas J. Walsh | 1994-11-08 |
| 5338208 | High density electronic connector and method of assembly | Thomas J. Walsh | 1994-08-16 |
| 5326245 | Apparatus for extruding materials that exhibit anisotropic properties due to molecular or fibril orientation as a result of the extrusion process | Thomas J. Walsh | 1994-07-05 |
| 5324205 | Array of pinless connectors and a carrier therefor | Umar M. Ahmad, George Czornyj, Harry K. Harrison, Richard Ralph Jones | 1994-06-28 |
| 5312238 | Apparatus for extruding materials that exhibit anisotropic properties by means of reciprocating die surfaces | Thomas J. Walsh | 1994-05-17 |
| 5305523 | Method of direct transferring of electrically conductive elements into a substrate | Julian G. Cempa, Robert O. Lussow, James A. McDonald, Donald E. Myers, Joseph D. Peruffo +1 more | 1994-04-26 |
| 5303862 | Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures | James J. Hedrick, Robert D. Johnson, Robert O. Lussow, James R. Lyerla, Jr., Donald E. Myers +3 more | 1994-04-19 |
| 5276964 | Method of manufacturing a high density connector system | Herbert R. Anderson, Jr., Julian G. Cempa, Robert O. Lussow, Donald E. Myers, Thomas J. Walsh | 1994-01-11 |