Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5372971 | Method for forming via hole in multiple metal layers of semiconductor device | Mi Young Kang, Jin-Ki Jung | 1994-12-13 |
| 5354713 | Contact manufacturing method of a multi-layered metal line structure | Jae K. Kim | 1994-10-11 |