Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5313098 | Packaging arrangement for power semiconductor devices | John J. Tumpey, Robert C. Eckenfelder, Sampat Shekhawat | 1994-05-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5313098 | Packaging arrangement for power semiconductor devices | John J. Tumpey, Robert C. Eckenfelder, Sampat Shekhawat | 1994-05-17 |