Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5360765 | Method of forming electrodes of semiconductor device | Ichiharu Kondo, Masami Yamaoka | 1994-11-01 |
| 5325012 | Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element | Ichiya Sato, Hisanori Okamura, Satoshi Kokura, Minoru Yanagibashi | 1994-06-28 |
| 5289964 | Fluxless soldering process | Katsuhiro Izuchi | 1994-03-01 |