SO

Susumu Okikawa

HI Hitachi: 1 patents #856 of 3,149Top 30%
📍 Wenatchee, WA: #12 of 51 inventorsTop 25%
🗺 Washington: #319 of 1,789 inventorsTop 20%
Overall (1994): #64,521 of 165,921Top 40%
1
Patents 1994

Issued Patents 1994

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
5285949 Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method Michio Tanimoto 1994-02-15