Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5299091 | Packaged semiconductor device having heat dissipation/electrical connection bumps and method of manufacturing same | Akio Hoshi, Yukihiro Sato, Toyomasa Koda, Isao Yoshida | 1994-03-29 |