HE

Hiroshi Endoh

JL Japan Aviation Electronics Industry, Limited: 1 patents #4 of 14Top 30%
NE Nec: 1 patents #206 of 1,007Top 25%
NS Nippon Steel: 1 patents #42 of 283Top 15%
TK Toyo Boseki Kabushiki Kaisha: 1 patents #12 of 61Top 20%
Overall (1994): #32,210 of 165,921Top 20%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5327326 Large scale integrated package structure Mitsuo Komoto 1994-07-05
5288813 Viscoelastic resin composition or vibration damping material Hiroshi Hirakouchi, Masanori Nakamura, Takeshi Yatsuka, Nobuo Kadowaki, Yoshimasa Zama 1994-02-22