Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5285016 | Wiring board provided with a heat bypass layer | Yasunori Narizuka, Masakazu Ishino, Eiji Matsuzaki | 1994-02-08 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5285016 | Wiring board provided with a heat bypass layer | Yasunori Narizuka, Masakazu Ishino, Eiji Matsuzaki | 1994-02-08 |