Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5362667 | Bonded wafer processing | Robert K. Lowry, George V. Rouse, James F. Buller, William H. Speece | 1994-11-08 |
| 5279850 | Gas phase chemical reduction of metallic branding layer of electronic circuit package for deposition of branding ink | David A. Decrosta, Martin Walter | 1994-01-18 |