KI

Kenji Isihara

FC Fukuda Metal Foil & Powder Co.: 2 patents #2 of 15Top 15%
Overall (1994): #27,908 of 165,921Top 20%
2
Patents 1994

Issued Patents 1994

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5356528 Copper foil for printed circuits and method of producing same Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima 1994-10-18
5338619 Copper foil for printed circuits and method of producing same Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima 1994-08-16