Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5349219 | Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device | Toshiaki Murao, Takeo Kikuchi, Hidenori Nomura, Hiroyuki Sugamoto | 1994-09-20 |