Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5305179 | Surface-mounting type semiconductor package having an improved efficiency for heat dissipation | Michio Sono, Junichi Kasai, Kazuhiko Mitobe, Masanori Yoshimoto | 1994-04-19 |