Issued Patents 1994
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5338970 | Multi-layered integrated circuit package with improved high frequency performance | Steven R. Boyle, Robert J. Proebsting | 1994-08-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5338970 | Multi-layered integrated circuit package with improved high frequency performance | Steven R. Boyle, Robert J. Proebsting | 1994-08-16 |