Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5320919 | Copper foil for inner layer circuit of multi-layered printed circuit board, method of producing the same and multi-layered printed circuit board having the same | Keiji Azuma, Kimikazu Katoh, Takashi Inada | 1994-06-14 |
| 5286330 | Method of producing copper-clad laminated board | Keiji Azuma, Kimikazu Katoh | 1994-02-15 |