Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5372295 | Solder material, junctioning method, junction material, and semiconductor device | Katunori Asai, Yoshihiro Tomita, Hideyuki Ichiyama, Seizou Ohumae, Yoshirou Nishinaka +3 more | 1994-12-13 |
| 5343233 | Image reproducing system having means for generating a pattern signal including a plurality of memories | — | 1994-08-30 |
| 5317191 | Low-melting-point junction material having high-melting-point particles uniformly dispersed therein | — | 1994-05-31 |