Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5355283 | Ball grid array with via interconnection | Tadashi Hirakawa | 1994-10-11 |
| 5328870 | Method for forming plastic molded package with heat sink for integrated circuit devices | — | 1994-07-12 |