Issued Patents 1994
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5344795 | Method for encapsulating an integrated circuit using a removable heatsink support block | Seyed H. Hashemi, Michael A. Olla, Richard D. Nelson | 1994-09-06 |
| 5328087 | Thermally and electrically conductive adhesive material and method of bonding with same | Richard D. Nelson, Robert W. Froehlich | 1994-07-12 |
| 5309321 | Thermally conductive screen mesh for encapsulated integrated circuit packages | Michael A. Olla, Seyed H. Hashemi | 1994-05-03 |