Issued Patents 1994
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5368217 | High force compression flip chip bonding method and system | Michael J. Bertram | 1994-11-29 |
| 5283946 | Method and apparatus for forming metal leads | James Wehrly, Michael J. Bertram | 1994-02-08 |