SS

Susumu Sawafuji

TC Tokyo Seimitsu Co.: 2 patents #1 of 3Top 35%
Overall (1989): #15,256 of 140,708Top 15%
2
Patents 1989

Issued Patents 1989

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
4852304 Apparatus and method for slicing a wafer Katsuo Honda 1989-08-01
4838238 Internal peripheral edge type blade holding device Katsuo Honda, Tomio Tomita 1989-06-13