KH

Katsuo Honda

TC Tokyo Seimitsu Co.: 2 patents #1 of 3Top 35%
Overall (1989): #23,022 of 140,708Top 20%
2
Patents 1989

Issued Patents 1989

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
4852304 Apparatus and method for slicing a wafer Susumu Sawafuji 1989-08-01
4838238 Internal peripheral edge type blade holding device Susumu Sawafuji, Tomio Tomita 1989-06-13