RS

Reinhard Stengl

DU Duke University: 1 patents #2 of 21Top 10%
📍 Munich, NC: #1 of 1 inventorsTop 100%
Overall (1989): #66,683 of 140,708Top 50%
1
Patents 1989

Issued Patents 1989

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
4883215 Method for bubble-free bonding of silicon wafers Ulrich M. Goesele 1989-11-28