UG

Ulrich M. Goesele

DU Duke University: 1 patents #2 of 21Top 10%
📍 Grevesmühlen, NC: #1 of 1 inventorsTop 100%
Overall (1989): #47,125 of 140,708Top 35%
1
Patents 1989

Issued Patents 1989

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
4883215 Method for bubble-free bonding of silicon wafers Reinhard Stengl 1989-11-28