Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4876219 | Method of forming a heteroepitaxial semiconductor thin film using amorphous buffer layers | Takashi Eshita, Fumitake Mieno, Yuji Furumura | 1989-10-24 |
| 4804560 | Method of selectively depositing tungsten upon a semiconductor substrate | Yoshimi Shioya, Yasushi Oyama, Norihisa Tsuzuki, Mamoru Maeda, Masaaki Ichikawa +6 more | 1989-02-14 |