Issued Patents 1989
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4853343 | Method for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refill | Akihisa Uchida, Toshihiko Takakura, Katsumi Ogiue, Yoichi Tamaki, Masao Kawamura | 1989-08-01 |