Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4853343 | Method for fabricating a semiconductor integrated circuit device having thick oxide films and groove etch and refill | Akihisa Uchida, Daisuke Okada, Toshihiko Takakura, Katsumi Ogiue, Masao Kawamura | 1989-08-01 |
| 4819054 | Semiconductor IC with dual groove isolation | Mikinori Kawaji, Toshihiko Takakura, Akihisa Uchida, Shigeo Kuroda, Takeo Shiba +2 more | 1989-04-04 |