Issued Patents 1989
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4855251 | Method of manufacturing electronic parts including transfer of bumps of larger particle sizes | Kiyoshi Iyogi, Koji Yamakawa | 1989-08-08 |
| 4835344 | Electronic component parts and method for manufacturing the same | Kiyoshi Iyogi, Takaaki Yasumoto, Toshirou Yanazawa, Masako Nakahashi, Hiromitsu Takeda | 1989-05-30 |
| 4797530 | Ceramic circuit substrates and methods of manufacturing same | — | 1989-01-10 |