Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4855251 | Method of manufacturing electronic parts including transfer of bumps of larger particle sizes | Koji Yamakawa, Nobuo Iwase | 1989-08-08 |
| 4835344 | Electronic component parts and method for manufacturing the same | Takaaki Yasumoto, Toshirou Yanazawa, Nobuo Iwase, Masako Nakahashi, Hiromitsu Takeda | 1989-05-30 |