Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4878108 | Heat dissipation package for integrated circuits | William Ward | 1989-10-31 |
| 4862245 | Package semiconductor chip | Richard P. Pashby, Sigvart J. Samuelsen, William Ward | 1989-08-29 |
| 4821945 | Single lead automatic clamping and bonding system | Judith A. Chase, Robert J. Redmond, Stephen Garrett Starr, II | 1989-04-18 |
| 4796078 | Peripheral/area wire bonding technique | Robert J. Redmond, William Ward | 1989-01-03 |