Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4878108 | Heat dissipation package for integrated circuits | Douglas W. Phelps, Jr. | 1989-10-31 |
| 4862245 | Package semiconductor chip | Richard P. Pashby, Douglas W. Phelps, Jr., Sigvart J. Samuelsen | 1989-08-29 |
| 4846983 | Novel carbamate additives for functional fluids | — | 1989-07-11 |
| 4796078 | Peripheral/area wire bonding technique | Douglas W. Phelps, Jr., Robert J. Redmond | 1989-01-03 |