Issued Patents 1989
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4825284 | Semiconductor resin package structure | Tasao Soga, Marahiro Goda, Fumio Nakano, Tadao Kushima, Fumiyuki Kobayashi +1 more | 1989-04-25 |
| 4821142 | Ceramic multilayer circuit board and semiconductor module | Hiroichi Shinohara, Kousei Nagayama, Satoru Ogihara, Tasao Soga | 1989-04-11 |