Issued Patents 1989
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4884170 | Multilayer printed circuit board and method of producing the same | Nobuaki Ohki, Norio Sengoku | 1989-11-28 |
| 4836434 | Method and apparatus for airtightly packaging semiconductor package | Takaji Takenaka, Hideki Watanabe | 1989-06-06 |
| 4837663 | Electronic apparatus cooling system | Shizuo Zushi, Mitsuo Miyamoto, Hiroshi Gou, Tetsuo Ogata | 1989-06-06 |
| 4825284 | Semiconductor resin package structure | Tasao Soga, Marahiro Goda, Fumio Nakano, Tadao Kushima, Nobuyuki Ushifusa +1 more | 1989-04-25 |