Issued Patents 1989
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4878611 | Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate | Francis LoVasco | 1989-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4878611 | Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate | Francis LoVasco | 1989-11-07 |