FL

Francis LoVasco

📍 Hopatcong, NJ: #3 of 12 inventorsTop 25%
🗺 New Jersey: #926 of 3,756 inventorsTop 25%
Overall (1989): #114,482 of 140,708Top 85%
1
Patents 1989

Issued Patents 1989

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
4878611 Process for controlling solder joint geometry when surface mounting a leadless integrated circuit package on a substrate Michael A. Oien 1989-11-07