Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068298 | High power density 3D semiconductor module packaging | Yangang Wang, Haihui Luo | 2024-08-20 |
| 11848375 | IGBT chip having folded composite gate structure | Chunlin Zhu, Liheng Zhu | 2023-12-19 |
| 11630144 | In-situ monitoring method and apparatus for power electronic device explosion | Sheng Liu, Zhiwen Chen, Fang Dong, Li Liu | 2023-04-18 |
| 11329130 | IGBT chip having mixed gate structure | Chunlin Zhu, Liheng Zhu | 2022-05-10 |
| 10680067 | Silicon carbide MOSFET device and method for manufacturing the same | Yidan Tang, Huajun Shen, Yun Bai, Jingtao Zhou, Chengyue Yang +2 more | 2020-06-09 |
| 10475896 | Silicon carbide MOSFET device and method for manufacturing the same | Yunbin Gao, Chengzhan Li, Yudong Wu, Jingjing Shi, Yanli Zhao | 2019-11-12 |
| 10418469 | Insulated gate bipolar transistor and preparation method therefor | Rongzhen Qin, Jianwei Huang, Haihui Luo, Xiaoping Dai | 2019-09-17 |
| 10319595 | Reverse conducting IGBT device and manufacturing method therefor | Haihui Luo, Haibo XIAO, Jianwei Huang | 2019-06-11 |