Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362248 | Coreless package structure and method for manufacturing same | E-Tung Chou, Wen-Lun Lo | 2016-06-07 |
| 9173298 | Packaging substrate, method for manufacturing same, and chip packaging structure having same | E-Tung Chou, Wen-Lun Lo | 2015-10-27 |
| 9165790 | Packaging substrate, method for manufacturing same, and chip packaging body having same | E-Tung Chou, Wen-Lun Lo | 2015-10-20 |