Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11876071 | System-on-wafer structure and fabrication method | Weihao Wang, Shunbin Li, Ruyun Zhang, Qinrang Liu, Zhiquan Wan +1 more | 2024-01-16 |
| 11776879 | Three-dimensional stacked package structure with micro-channel heat dissipation structure and packaging method thereof | Weihao Wang, Shunbin Li, Ruyun Zhang | 2023-10-03 |