Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11955454 | Wafer bonding apparatus and method | Guoliang Chen, Yang Liu, Wu Liu | 2024-04-09 |
| 11257706 | Semiconductor device flipping apparatus | Tao Ding, Wu Liu, Rui Xing, Guoliang Chen | 2022-02-22 |
| 10790260 | Plasma activation treatment for wafer bonding | Tao Ding, Wu Liu, Rui Xing, Guoliang Chen | 2020-09-29 |