Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5541447 | Lead frame | Seiya Nishimura, Masayoshi Takabayashi, Tokuyoshi Ohta | 1996-07-30 |
| 5498325 | Method of electroplating | Seiya Nishimura, Tokuyoshi Ohta | 1996-03-12 |
| 5441194 | Thermo-compression assembly/disassembly system for electric circuit board in inert ambience | Seiya Nishimura, Tokuyoshi Ohta | 1995-08-15 |
| 5441620 | Electroplating apparatus | Seiya Nishimura, Tokuyoshi Ohta | 1995-08-15 |
| 5431801 | Electroplating method and apparatus | Seiya Nishimura, Tokuyoshi Ohta | 1995-07-11 |
| 5347709 | Method of making lead frame | Seiya Nishimura, Masayoshi Takabayashi, Tokuyoshi Ohta | 1994-09-20 |