Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8138757 | Manufacturing method for magnetic sensor and lead frame therefor | Hiroshi Adachi, Hiroshi Saitoh, Hideki Sato, Masayoshi Omura | 2012-03-20 |
| 7964942 | Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same | Hirotaka Eguchi | 2011-06-21 |
| 7867827 | Physical quantity sensor, lead frame, and manufacturing method therefor | Masayoshi Omura | 2011-01-11 |
| 7829982 | Lead frame, sensor including lead frame and method of forming sensor including lead frame | Hiroshi Saitoh | 2010-11-09 |
| 7791180 | Physical quantity sensor and lead frame used for same | — | 2010-09-07 |
| 7754130 | Method for manufacturing physical quantity sensor | Hiroshi Saitoh | 2010-07-13 |
| 7727793 | Physical quantity sensor and manufacturing method therefor | Hiroshi Saitoh | 2010-06-01 |
| 7607355 | Semiconductor device | Yukitoshi Suzuki | 2009-10-27 |
| 7595548 | Physical quantity sensor and manufacturing method therefor | Hiroshi Saitoh | 2009-09-29 |
| 7554182 | Semiconductor device and package, and method of manufacturer therefor | Hiroshi Saitoh | 2009-06-30 |
| 7541665 | Lead frame for a magnetic sensor | Hiroshi Adachi, Hiroshi Saitoh, Hideki Sato, Masayoshi Omura | 2009-06-02 |
| 7541294 | Semiconductor package and semiconductor package mounting method | — | 2009-06-02 |
| 7524696 | Sensor including lead frame and method of forming sensor including lead frame | — | 2009-04-28 |
| 7494838 | Manufacturing method for magnetic sensor and lead frame therefor | Hiroshi Adachi, Hiroshi Saitoh, Hideki Sato, Masayoshi Omura | 2009-02-24 |
| 7397112 | Semiconductor package and lead frame therefor | Takashi Sato | 2008-07-08 |
| 7319042 | Method and apparatus for manufacture and inspection of semiconductor device | — | 2008-01-15 |
| 7290448 | Physical quantity sensor, lead frame, and manufacturing method therefor | Masayoshi Omura | 2007-11-06 |
| 7195953 | Method of manufacturing a semiconductor package using a lead frame having through holes or hollows therein | — | 2007-03-27 |
| 7187063 | Manufacturing method for magnetic sensor and lead frame therefor | Hiroshi Adachi, Hiroshi Saitoh, Hideki Sato, Masayoshi Omura | 2007-03-06 |
| 7170149 | Semiconductor device and package, and method of manufacture therefor | Hiroshi Saitoh | 2007-01-30 |
| 6979910 | Semiconductor package and semiconductor package mounting method | — | 2005-12-27 |
| 6861282 | Semiconductor package and semiconductor package mounting method | — | 2005-03-01 |